Learn Everything About Ball Grid Array (BGA) Packaging

 Ball grid array (BGA) packaging is a type of surface-mount packaging used for integrated circuits (ICs) and can provide more interconnection pins that can be put on dual-in-line or flat package. 

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The entire bottom surface of the device can be used and traces connecting the package leads to wires connecting the die to the package, which are shorter hence provide better performance at high speed.

Advantages of  Ball grid array :
 
High density : 


The BGA is a solution to the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount (SOIC) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally bridging adjacent pins with solder grew.

Heat conduction : 


A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower thermal resistance between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.

Low-inductance leads : 

The shorter an electrical conductor, the lower its unwanted inductance, a property which causes unwanted distortion of signals in high-speed electronic circuits. BGAs, with their very short distance between the package and the PCB, have low lead inductances, giving them superior electrical performance to pinned devices.


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